With the advent of system-in-package (SiP) chiplet-based design and heterogeneous 2.5D/3D integration, thermal-induced warpage has become a critical reliability concern. While conventional numerical a...
IR-drop is a critical power integrity challenge in modern VLSI designs that can cause timing degradation, reliability issues, and functional failures if not detected early in the design flow. Conventi...
Recent advances in large language models (LLMs) suggest strong potential for automating analog circuit design. Yet most LLM-based approaches rely on a single-model loop of generation, diagnosis, and c...